XC6VSX315T-2FF1156I

发布时间:2021/3/1

XC6VSX315T-2FF1156I

芯片详细信息

Manufacturer Part Number:

XC6VSX315T-2FF1156I

Pbfree Code:

 No

Rohs Code:

 No

Part Life Cycle Code:

Active

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

FBGA-1156

Pin Count:

1156

Reach Compliance Code:

not_compliant

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Manufacturer:

Xilinx

Risk Rank:

5.24

Clock Frequency-Max:

1286 MHz

Combinatorial Delay of a CLB-Max:

4.29 ns

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e0

Length:

35 mm

Moisture Sensitivity Level:

4

Number of Inputs:

600

Number of Logic Cells:

314880

Number of Outputs:

600

Number of Terminals:

1156

Operating Temperature-Max:

100 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1156,34X34,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

NOT SPECIFIED

Power Supplies:

1,1.2/2.5 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

3.5 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.05 V

Supply Voltage-Min:

0.95 V

Supply Voltage-Nom:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

35 mm