XC6VSX315T-1FFG1759I

发布时间:2021/3/1

芯片详细信息

Manufacturer Part Number:

XC6VSX315T-1FFG1759I

 

Pbfree Code:

 Yes

 

Rohs Code:

 Yes

 

Part Life Cycle Code:

Active

 

Ihs Manufacturer:

XILINX INC

 

Part Package Code:

BGA

 

Package Description:

42.50 X 42.50 MM, LEAD FREE, FBGA-1759

 

Pin Count:

1759

 

Reach Compliance Code:

not_compliant

 

ECCN Code:

3A001.A.7.A

 

HTS Code:

8542.39.00.01

 

Manufacturer:

Xilinx

 

Risk Rank:

5.25

 

Clock Frequency-Max:

1098 MHz

 

Combinatorial Delay of a CLB-Max:

5.08 ns

 

JESD-30 Code:

S-PBGA-B1759

 

JESD-609 Code:

e1

 

Length:

42.5 mm

 

Moisture Sensitivity Level:

4

 

Number of Inputs:

720

 

Number of Logic Cells:

314880

 

Number of Outputs:

720

 

Number of Terminals:

1759

 

Operating Temperature-Max:

100 °C

 

Operating Temperature-Min:

-40 °C

 

Package Body Material:

PLASTIC/EPOXY

 

Package Code:

BGA

 

Package Equivalence Code:

BGA1759,42X42,40

 

Package Shape:

SQUARE

 

Package Style:

GRID ARRAY

 

Peak Reflow Temperature (Cel):

245

 

Power Supplies:

1,1.2/2.5 V

 

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

 

Qualification Status:

Not Qualified

 

Seated Height-Max:

3.5 mm

 

Subcategory:

Field Programmable Gate Arrays

 

Supply Voltage-Max:

1.05 V

 

Supply Voltage-Min:

0.95 V

 

Supply Voltage-Nom:

1 V

 

Surface Mount:

YES

 

Technology:

CMOS

 

Temperature Grade:

INDUSTRIAL

 

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

 

Terminal Form:

BALL

 

Terminal Pitch:

1 mm

 

Terminal Position:

BOTTOM

 

Time@Peak Reflow Temperature-Max (s):

30

 

Width:

42.5 mm